Board-to-Board Mezzanine Interconnect at 0.40 mm Pitch
Its 0.016" (0.40 mm) pitch and 0.027" (0.68 mm) height above the PCB let it fit into tight z-axis gaps between stacked boards — the mated stacking height lands at 0.7 mm.
SMT Assembly and Retention Features
The pick-and-place vacuum area and solder retention tails are built into the part — no separate hold-down hardware is needed during reflow.
