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5050702222 — Molex product photo

Molex 5050702222 SlimStack Plug, 22 Pos, 0.35mm Pitch

MPN5050702222
Active

Molex SlimStack 505070 series, 5050702222, Plug Outer Shroud Contacts, 22 positions, 2 rows, 0.014" (0.35mm) pitch, Surface Mount, Gold, 0.019" (0.48mm) above board.

$0.3855Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
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Specifications

5050702222 Technical Specifications
ParameterValue
SeriesSlimStack 505070
Mounting typeSurface Mount
Connector typePlug, Outer Shroud Contacts
Height above board0.019\" (0.48mm)
Mated stacking heights0.6mm
Pitch0.014\" (0.35mm)
PackageTape & Reel (TR) Cut Tape (CT)
FeaturesPick and Place, Solder Retention
Contact finishGold
Rows2
Positions22
Contact finish thickness4.00µin (0.100µm)

Product details

0.35 mm Pitch, 22-Position Plug for Tight Mezzanine Stacking

The Molex 5050702222 is a 22-position plug from the SlimStack 505070 series, designed for board-to-board mezzanine connections where vertical space is at a premium. At a 0.014" (0.35 mm) pitch, this connector packs 22 circuits into a compact footprint, making it suited for handheld devices, wearables, and other space-constrained electronics where every millimeter of board real estate counts. The mated stacking height of 0.6 mm, combined with a height above board of 0.019" (0.48 mm), defines the z-axis clearance between parallel PCBs — a critical dimension when specifying the board spacing in a stacked assembly. The plug uses outer shroud contacts, meaning the male contacts are recessed within a plastic shroud that guides alignment during mating and protects the contacts from damage before assembly. Gold contact finish at 4.00 µin (0.100 µm) thickness provides reliable signal transfer across repeated mating cycles, with the gold layer resisting oxidation that would increase contact resistance over time. Surface-mount termination, combined with pick-and-place features and solder retention, confirms the part is engineered for automated SMT assembly lines. The solder retention features hold the connector in place during reflow, preventing tombstoning or shift that can occur with fine-pitch parts.

Board Layout: Pitch and Stack Height Drive the Footprint

For the board layout engineer, the 0.35 mm pitch is the tightest constraint. This pitch demands precise PCB trace routing between pads — typically requiring a controlled impedance stack-up and fine-line etching capability. The two-row arrangement with 22 positions means 11 contacts per row, with the rows offset to maximize routing channel escape. The 0.6 mm mated stack height sets the z-height budget: the receptacle and plug together occupy just over half a millimeter between boards, which is typical for ultra-slim portable product designs. The surface-mount pads must match the recommended footprint in the product drawing. The solder retention features add mechanical hold during reflow, but the connector itself does not carry board locks — the primary retention comes from the solder joints after reflow. For vibration-prone environments, confirm the application's shock and vibration profile against the connector's rated capability.

Frequently asked questions

What is the pitch of the Molex 5050702222?

The pitch is 0.014" (0.35 mm), which is the center-to-center spacing between adjacent contacts. This fine pitch is the primary factor determining the PCB footprint and routing density.

What is the mated stacking height for the 5050702222?

The mated stacking height is 0.6 mm, meaning the total height occupied by the mated plug and receptacle pair between two parallel PCBs is 0.6 mm. The plug itself sits 0.019" (0.48 mm) above the board surface.