Solder retention features and a pick-and-place surface are built into the part, so it runs through standard reflow without secondary hand-soldering.
The right-angle solder tails are surface-mount only; there is no through-hole variant in this order code. Confirm the board pad layout matches the 1.25mm pitch and the 8.95mm insulation height to ensure clearance to nearby components.
Application and environment
The 18-position count suits moderate I/O density on a control board or LED driver where you need a compact but serviceable interconnect. The dual-row layout keeps the connector width narrower than a single-row 18-position part at the same pitch.