The 5055750871: This is a Molex Micro-Lock PLUS 505575 series header, 8 positions, 2.00 mm pitch, surface-mount solder termination. Mated stacking height is 11.1 mm, so budget that z-height in the enclosure layout.
Contact plating and current derating
Tin is a workhorse finish for moderate mating-cycle applications — expect a few dozen cycles before wear-through, which is fine for harnesses assembled once and mated infrequently in the field. In practice, for 22-24 AWG wire, derate to around 3 A per contact at 85°C ambient; the 105°C ceiling is the absolute limit.
The part is ROHS3 compliant.
Mating half and board footprint
This header mates with a Micro-Lock PLUS 505575 series receptacle housing (sold separately). Confirm the mating receptacle part number matches the 8-circuit count and 2.00 mm pitch before committing.