Board Fit and Circuit Count
The 53290-1280: That pitch is standard for board-to-board stacking where routing density and z-height budget are balanced — the 0.8 mm contact beam keeps the mated pair rigid without over-constraining the PCB alignment.

Molex 53290-1280, 2.0 mm pitch board-to-board wafer assembly, 12 circuits, white housing, ROHS3 compliant, active production.
| Parameter | Value |
|---|---|
| Series | * |
| Package | Box |
The 53290-1280: That pitch is standard for board-to-board stacking where routing density and z-height budget are balanced — the 0.8 mm contact beam keeps the mated pair rigid without over-constraining the PCB alignment.
2.0 mm pitch — this is the centre-to-centre distance between adjacent contacts, matching the board layout for the mating header.
Yes, ROHS3 compliant per the manufacturer designation.