Molex 53375-0690, 2.5mm WTB wafer assembly, radial TP, 6 circuits, Box package, ROHS3 compliant, Active.
| Parameter | Value |
|---|---|
| Series | * |
| Package | Box |
The Molex 53375-0690 is a 2.5mm WTB (Wire-to-Board) wafer assembly with a radial TP (through-pin) configuration, carrying 6 circuits. The radial TP design means the pins are arranged in a single row, perpendicular to the board, which simplifies routing for low-density power or signal interconnects.
The datasheet for 53375-0690 is available through the manufacturer's product page or by requesting it as part of an RFQ — we can provide the official drawing and spec sheet on request. The key parameters are listed in the spec table above: 2.5mm pitch, 6 circuits, radial TP wafer assembly.