Backplane Header for Dense Signal Routing
The Molex 736430000 is a 72-position HDM (High Density Metric) series header with male pins, laid out in a 6-row, 12-column grid at 2.00mm pitch. This is the signal-density workhorse for a backplane midplane — the 2.00mm pitch packs 72 circuits into a footprint that a 2.54mm grid would need nearly twice the board area to match.
The gold flash (contact finish thickness: Flash) on the mating surface provides a low-resistance interface for the moderate mating cycles a backplane sees during card insertion and extraction.
Press-Fit Termination — No Solder, Specific Tooling
The press-fit termination means the header is inserted into the backplane with a pneumatic or hydraulic press, not a wave-solder or reflow line. The compliant pin compresses as it enters the plated through-hole, creating a gas-tight interference fit. This eliminates the solder joint, which is a reliability advantage in high-vibration backplane environments, but it does require the correct insertion tooling and a backplane with the specified finished hole diameter. The through-hole mounting is the hole pattern the press-fit pin engages — the header is not surface-mount.