240-Position Backplane Header for High-Density Differential Routing
The Molex 760551605 is a 240-position header from the Impact 76055 series, designed as the male pin interface in a high-speed backplane connector system. It carries 80 differential pairs across 15 rows and 16 columns on a 0.053" (1.35mm) pitch — a density that lets a single connector handle a full switch-fabric line card's worth of lanes without spreading the footprint across multiple connectors. The press-fit termination eliminates the thermal cycle and wicking risks of wave soldering, making this header a standard choice for multilayer backplanes where solder rework would compromise the board.
Pitch and Routing — What the 0.053" Spacing Means for the Board Layout
At 0.053" (1.35mm) pitch, the escape routing for 80 differential pairs demands a high-layer-count backplane with microvias or buried vias directly under the connector footprint. The 15-row stagger means the outer rows route through the inner layers before the inner rows — a via pattern that is standard for Impact-series backplanes but must be accounted for in the stack-up planning. The 30V voltage rating is low relative to the density; this connector is a signal-only interconnect, not a power delivery path.
Press-Fit Assembly — No Solder, No Rework Headaches
The through-hole mounting means the header is inserted from the component side and the compliant pin holds it in place — no secondary retention hardware needed for normal handling.