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Samtec Inc. QSH0 Mezzanine Stacking Series

3 variants · Samtec Inc.

About the Samtec Inc. QSH0 Mezzanine Stacking Series

IC Source Direct is a China connector distributor, supplier and independent procurement agent for Samtec Inc. QSH0 Mezzanine Stacking Series components, matching housing, contact and mating cycles across the Shenzhen interconnect channel. The Samtec Inc. QSH0 Mezzanine Stacking Series series groups 3 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. Every variant in the range shares a common contact finish of Gold, height above board of 0.128\" (3.25mm) and mated stacking heights of 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 25mm. Variants differ by connector type, contact finish thickness and features, so you can match the exact connector type your application requires using the selection guide below. All listed Samtec Inc. QSH0 Mezzanine Stacking Series part numbers are active and orderable.

Select a variant by

Connector type
Differential Pair Array, Female · Receptacle, Center Strip Contacts
Contact finish thickness
3.00µin (0.076µm) · 10.0µin (0.25µm)
Features
Board Guide, Ground Bus (Plane) · Board Guide, Ground Bus (Plane), Pick and Place
Package
Tape & Reel (TR) Cut Tape (CT) · Tray
Positions
40 · 60

Shared specifications

Contact finish
Gold
Height above board
0.128\" (3.25mm)
Mated stacking heights
5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 25mm
Mounting
Surface Mount
Pitch
0.020\" (0.50mm)
Rows
2

Variant comparison

ParameterQSH-020-01-F-D-DP-AQSH-020-01-L-D-DP-A-TRQSH-030-01-F-D-A-K
Connector typeDifferential Pair Array, FemaleDifferential Pair Array, FemaleReceptacle, Center Strip Contacts
Contact finish thickness3.00µin (0.076µm)10.0µin (0.25µm)3.00µin (0.076µm)
FeaturesBoard Guide, Ground Bus (Plane)Board Guide, Ground Bus (Plane)Board Guide, Ground Bus (Plane), Pick and Place
PackageTrayTape & Reel (TR) Cut Tape (CT)Tray
Positions404060

Request a quote on any Samtec Inc. QSH0 Mezzanine Stacking Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.

All variants