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CUI Devices PJ04 Wire To Board Series

2 variants · CUI Devices

About the CUI Devices PJ04 Wire To Board Series

The CUI Devices PJ04 Wire To Board Series series groups 2 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. Every variant in the range shares a common body color of Black, body material of - and connector size of -. Variants differ by actual diameter, contact material and contact material - plating, so you can match the exact actual diameter your application requires using the selection guide below. All listed CUI Devices PJ04 Wire To Board Series part numbers are active and orderable.

Select a variant by

Actual diameter
0.051\" (1.30mm ID), 0.150\" (3.80mm OD) · 0.079\" (2.00mm ID), 0.256\" (6.50mm OD)
Contact material
Brass · Brass, Copper Alloy
Contact material - plating
Silver · Tin
Current rating
2 A · 5 A
Industry recognized mating diameter
1.30mm ID (0.051\"), 3.50mm OD (0.138\") · 2.50mm ID (0.098\"), 5.50mm OD (0.217\")
Mating length (Depth)
0.315\" (8.00mm) · 0.354\" (9.00mm)
Mounting
Through Hole · Through Hole, Right Angle
Termination
Solder · Solder Eyelet(s)

Shared specifications

Body color
Black
Body material
-
Connector size
-
Connector type
Jack
Features
Board Guide
Gender
Male
Housing material
Polybutylene Terephthalate (PBT)
Includes
-
Insulation color
-
Internal switch
Single Switch, Normally Closed
IP rating
-
Material flammability rating
UL94 V-0

Variant comparison

ParameterPJ-040DPJ-044BH
Actual diameter0.051\" (1.30mm ID), 0.150\" (3.80mm OD)0.079\" (2.00mm ID), 0.256\" (6.50mm OD)
Contact materialBrassBrass, Copper Alloy
Contact material - platingTinSilver
Current rating2 A5 A
Industry recognized mating diameter1.30mm ID (0.051\"), 3.50mm OD (0.138\")2.50mm ID (0.098\"), 5.50mm OD (0.217\")
Mating length (Depth)0.315\" (8.00mm)0.354\" (9.00mm)
MountingThrough Hole, Right AngleThrough Hole
TerminationSolderSolder Eyelet(s)

Request a quote on any CUI Devices PJ04 Wire To Board Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.

All variants