30-Position Board-to-Board Receptacle at 0.50mm Pitch
The DF12(3.0)30DS0.5V80: The 0.50mm pitch and 3mm mated stack height make it a compact interconnect for parallel PCB assemblies where vertical space is tight. Gold-plated center strip contacts and surface-mount termination suit automated assembly lines. Board guide features and solder retention aids help align the part during reflow and keep it in place through the solder joint.
Lifecycle Status — Obsolete, Sourced to Order
This part is officially listed as Obsolete. No direct factory replacement is on record from Hirose. If the design can tolerate a pitch or stack height change, a parametric search within the DF12 family may yield an active alternative, but no pin-compatible drop-in is specified by the manufacturer.
Stack Height and Mating Half
Gold contacts support repeated mating cycles typical of production test or field-service connections.