JST S6BP Series
2 variants · JST
About the JST S6BP Series
The JST S6BP Series series groups 2 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. Every variant in the range shares a common applications of -, connector type of Header and contact finish - mating of Tin. Variants differ by contact length - post, contact material and features, so you can match the exact contact length - post your application requires using the selection guide below. All listed JST S6BP Series part numbers are active and orderable.
Select a variant by
- Contact length - post
- - · 0.134\" (3.40mm)
- Contact material
- Brass · Copper Alloy
- Features
- - · Solder Retention
- Insulation height
- 0.189\" (4.80mm) · 0.217\" (5.51mm)
- Insulation material
- Polyamide (PA6T), Nylon 6T · Polyamide (PA66), Nylon 6/6
- Mounting
- Surface Mount, Right Angle · Through Hole, Right Angle
- Operating temperature
- -25°C ~ 85°C · -25°C~85°C
- Package
- Bulk · Tape & Reel (TR) Cut Tape (CT)
Shared specifications
- Applications
- -
- Connector type
- Header
- Contact finish - mating
- Tin
- Contact finish - post
- Tin
- Contact finish thickness - mating
- -
- Contact finish thickness - post
- -
- Contact length - mating
- 0.130\" (3.30mm)
- Contact shape
- Square
- Current rating
- 2A
- Fastening type
- Detent Lock
- Insulation color
- Natural
- IP rating
- -
Variant comparison
| Parameter | S6B-PH-K-S(LF)(SN) | S6B-PH-SM4-TB |
|---|---|---|
| Contact length - post | 0.134\" (3.40mm) | - |
| Contact material | Brass | Copper Alloy |
| Features | - | Solder Retention |
| Insulation height | 0.189\" (4.80mm) | 0.217\" (5.51mm) |
| Insulation material | Polyamide (PA66), Nylon 6/6 | Polyamide (PA6T), Nylon 6T |
| Mounting | Through Hole, Right Angle | Surface Mount, Right Angle |
| Operating temperature | -25°C~85°C | -25°C ~ 85°C |
| Package | Bulk | Tape & Reel (TR) Cut Tape (CT) |
Request a quote on any JST S6BP Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.