Skip to main content
Log in
Mill-Max Manufacturing Corp. 110-43-320-41-001000 — IC & Device Sockets

Mill-Max 110-43-320-41-001000 DIP Socket 20-Pos 2.54mm Pitch

MPN110-43-320-41-001000
Active

Mill-Max 110 series DIP socket, order code 110-43-320-41-001000, 20 positions, 2.54 mm pitch, 0.3" (7.62 mm) row spacing, gold-plated beryllium copper mating contacts, tin-plated brass post contacts, through-hole solder termination, tube package.

$2.3400Ref. price · indicative, final on quote
RoHSROHS3 Compliant
Series110
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

110-43-320-41-001000 key specifications
ParameterValue
TypeDIP, 0.3\" (7.62mm) Row Spacing
Series110
MountingThrough Hole
Current rating3 A
Operating temperature-55°C ~ 125°C
Housing materialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Contact material - postBrass Alloy
Contact material - matingBeryllium Copper
PackageTube
FeaturesOpen Frame
TerminationSolder
Pitch - post0.100\" (2.54mm)

All specifications

110-43-320-41-001000 additional specifications
ParameterValue
Pitch0.100\" (2.54mm)
Contact finish - postTin
Contact finish - matingGold
Termination post length0.125\" (3.18mm)
Contact finish thickness - post200.0µin (5.08µm)
Contact finish thickness - mating30.0µin (0.76µm)
Number of positions or pins20 (2 x 10)

Product details

DIP socket, 20-position open frame

The 110-43-320-41-001000 is a 20-position DIP socket in Mill-Max's 110 series, arranged in a 2 x 10 grid on 0.100" (2.54 mm) pitch with 0.3" (7.62 mm) row spacing. Mating contacts are beryllium copper with 30.0 µin (0.76 µm) gold finish rated for 3 A per contact; the open-frame construction aids airflow and inspection.

Gold-on-beryllium copper contacts

The mating contact uses beryllium copper — a spring alloy that maintains contact normal force over repeated insertion cycles — plated with 30.0 µin (0.76 µm) gold to resist corrosion in low-level signal environments. Post contacts are brass alloy with 200.0 µin (5.08 µm) tin finish, suited for solder-joint reliability in standard wave-solder profiles.