DIP socket for 0.4" row-spacing ICs
The 110-47-422-41-001000 is the 22-position (2 x 11) member of Mill-Max's 110 series DIP socket line, designed for packages with 0.4" (10.16mm) row spacing. Rated 3 A per contact with gold-plated mating surfaces on beryllium copper contacts, it suits repeated insertion and extraction during prototyping or production test.
Pitch and plating choices
Mating and post pitch are both 0.100" (2.54mm) — the same grid as standard DIP packages, so the socket footprint matches the IC lead spacing without adjustment. Mating contacts receive a flash gold finish; the solder tails are tin-plated at 200.0µin (5.08µm). Gold on the mating side resists corrosion across the -55°C to 125°C operating range, while the tin tails wet reliably during wave or hand soldering.
Production status and sourcing
ROHS3 compliant; the housing is PCT/polyester, rated for the full temperature range without outgassing concerns in sealed enclosures.