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Mill-Max Manufacturing Corp. 115-93-316-41-001000 — IC & Device Sockets

Mill-Max 115-93-316-41-001000 DIP Socket 16-Pin Gold

MPN115-93-316-41-001000
Active

Mill-Max 115 series DIP socket, order code 115-93-316-41-001000, 16 positions, 2 x 8 grid, 0.100" (2.54mm) pitch, 0.3" (7.62mm) row spacing, 3 A, gold-plated mating contacts, through-hole, solder termination, open frame.

$2.5100Ref. price · indicative, final on quote
RoHSRoHS non-compliant
Series115
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

115-93-316-41-001000 key specifications
ParameterValue
TypeDIP, 0.3\" (7.62mm) Row Spacing
Series115
MountingThrough Hole
Current rating3 A
Operating temperature-55°C ~ 125°C
Housing materialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Contact material - postBrass Alloy
Contact material - matingBeryllium Copper
PackageTube
FeaturesOpen Frame
TerminationSolder
Pitch - post0.100\" (2.54mm)

All specifications

115-93-316-41-001000 additional specifications
ParameterValue
Pitch0.100\" (2.54mm)
Contact finish - postTin-Lead
Contact finish - matingGold
Termination post length0.108\" (2.74mm)
Contact finish thickness - post200.0µin (5.08µm)
Contact finish thickness - mating30.0µin (0.76µm)
Number of positions or pins16 (2 x 8)

Product details

Open-frame DIP socket, 16 positions, gold contacts

The 115-93-316-41-001000 is a 16-position (2 x 8) open-frame DIP socket from Mill-Max's 115 series, with 0.100" (2.54mm) pitch and 0.3" (7.62mm) row spacing. It is rated 3 A per contact, uses gold-plated beryllium copper mating contacts (30.0µin gold), and operates from -55°C to 125°C.

Through-hole solder termination, tin-lead post finish

Termination is through-hole solder with a post length of 0.108" (2.74mm); the post finish is tin-lead (200.0µin). The housing is PCT/polyester; the open-frame design aids airflow and inspection of solder joints on the board.