The Molex 430450226 is a 2-position, dual-row header from the Micro-Fit 3.0 43045 series, designed for board-to-wire power interconnects. It carries 8 A per circuit at 600 V across a 3.00 mm pitch, with gold-plated mating contacts (30.0 µ") and tin-plated solder tails. The shrouded 4-wall housing with a locking ramp provides positive retention against vibration, making it suited for automotive, industrial, medical, and telecom harness assemblies.
What the ratings mean for your fit
The 2-position count is the first fit check — this header matches a 2-circuit BOM line exactly. The 3.00 mm pitch and 0.118" row spacing define the PCB footprint; the dual-row layout means the mating receptacle must also be a 2x1 configuration. The 8 A per circuit rating is the headline power spec — this is a power interconnect, not a signal-only header, so the contact plating grade matters more for cycle life than for initial resistance. The 30.0 µ" gold on the mating side supports repeated mating cycles and resists corrosion in field-service or high-humidity environments, while the tin post finish is standard for solder-joint reliability. The locking ramp fastening type provides audible and tactile feedback on mating, and the board lock feature secures the header to the PCB during wave soldering and against cable strain. The board guide aids alignment during assembly, reducing the risk of bent pins.
Mating and termination
This header mates with Micro-Fit 3.0 receptacle housings (such as the 43025 series) using the matching crimp terminals. The through-hole termination with kinked pins provides secure solder-joint retention. The locking ramp engages with the receptacle's latch for vibration-resistant mating.