The Molex 430450226 is the 2-position member of the Micro-Fit 3.0 43045 series, a 3.00 mm pitch dual-row board-to-cable power header. Gold plating on the mating interface (30.0 µin) handles repeated plug cycles; tin on the solder tails (100.0 µin) gives the solder joint a robust wetting surface. Rated 8 A per circuit at the mated interface and 600 V between adjacent circuits — enough for most low-voltage power distribution inside a chassis or across a board-to-harness boundary.
Retention and board fit
The 4-wall shroud and locking ramp on the header body mate with the matching Micro-Fit 3.0 plug housing to lock the connection under vibration. Board guides pilot the header during placement, and the board-lock shoulders stake it to the PCB after reflow — so the header does not lift at the corners when the cable side is pulled. The kinked pin terminations hold position in the through-hole during wave or hand soldering. Insulation height is 0.390 inches (9.91 mm) from the PCB seat to the top of the housing, and the post tail extends 0.125 inches (3.18 mm) below the board — verify your board thickness fits within that window before committing the footprint.
Lifecycle and compliance
The 430450226 is Active and ROHS3 Compliant per the manufacturer record — no last-time-buy watch needed, and the full series remains in normal production. Spec it into the BOM without an EOL contingency.