What it is
The Molex 430450413 is the 4-circuit member of the Micro-Fit 3.0 43045 family — a fully shrouded dual-row male header intended as the board-mount half of a wire-to-board interconnect. The 3.00mm (0.118-inch) pitch matches the series standard; the 4-wall shroud and locking ramp on the header shell provide mis-mate protection and positive retention once the mating receptacle is seated. Contact material is brass, insulation is black liquid crystal polymer glass-filled and rated UL94 V-0.
What the ratings mean
Current rating is 8 A per contact. The mixed plating — 15.0µin (0.38µm) gold on the mating face, 100.0µin (2.54µm) tin on the solder-post side — is the standard Micro-Fit 3.0 split: the gold handles repeated mating cycles at the interface without degrading; the thick tin post survives wave or hand-solder thermal exposure and provides good solder wetting. The board guide feature (moulded posts on the header body) aligns the receptacle during blind mating — a meaningful detail when the connector is accessed through a panel or enclosed chassis. Termination is kinked-pin through-hole; the kink retains the header in the PCB during wave-solder reflow before the solder fill takes hold.
Where this class is used
Micro-Fit 3.0 headers are a standard board-side interconnect in harness assemblies for industrial automation, medical equipment, and telecom infrastructure — anywhere a 3.00mm dual-row footprint with 8A per circuit handles both signal and moderate power distribution on the same board.
Mating half
The 430450413 mates with the matching Micro-Fit 3.0 receptacle housing — confirm the housing position count is also 4 circuits before committing to the BOM line.
Sourcing and compliance
No official successor or cross-reference order code is on record for this part. If the 4-position count fits the BOM, commit to the 430450413 directly via RFQ.