The Amphenol ICC (FCI) 10119109-326014LF is a 26-position dual-row BERGSTIK II board-to-board header at the standard 0.100 inch (2.54 mm) pitch, terminated by through-hole solder posts and loaded with square male pins in an unshrouded breakaway body. Gold plating on the mating interface is 50.0 µin (1.27 µm) — a notably thick deposit for this pitch class, giving better fretting resistance and lower contact resistance across repeated mates than the tin-plated siblings in the same series.
Applications
Board-to-board stacking at 0.100 inch pitch is the canonical use — this is the go-to density for legacy digital I/O, MCU bus routing, and industrial control card-edge interconnects where 2.54 mm gives enough routing channel between pins for manual or wave-solder assembly. The push-pull fastening type handles the mating retention; the square pin geometry locks into matching IDC or receptacles without rotation.
Key Ratings
The insulation height of 0.100 inch (2.54 mm) sets the board-stack gap when this header is used as a card-edge guide. Contact post length of 0.120 inch (3.05 mm) accommodates typical PCB thickness; overall contact length is 0.760 inch (19.30 mm), meaning the post extends well below the board for hand-solder touch-up if needed. All 26 positions are loaded — no open positions to account for in the footprint. The housing meets UL94 V-0. The 50.0 µin (1.27 µm) gold over copper alloy is the spec to watch: at this pitch and current class, the plating grade matters more than the headline current for cycle life. Tin-plated siblings in the same series handle fewer reconnect cycles before contact resistance climbs.