Contact plating and what it means for the application
The 10119110-538003LF: Gold plating at 30.0 µin (0.76 µm) on the mating surface is a mid-grade precious-metal deposit — enough for repeated mating cycles and reliable low-level signal contact, but not the full hard-gold stack specified for high-cycle or high-current power joints. The contact material is copper alloy, which carries the current path through the header body into the plated-through hole. All 38 positions are fully loaded, so the connector arrives as a complete 38-circuit assembly ready to mount.
Mechanical form factor for board layout
Right-angle through-hole mounting sits flush at the board edge for horizontal mated orientation. The insulation height of 0.190" (4.83 mm) sets the standoff above the PCB surface — relevant for keeping the mated interface clear of nearby components. Contact length post of 0.318" (8.08 mm) gives adequate solder fillet length for through-hole reliability. The unshrouded design means the pins are exposed on all four sides of the header body — adequate for single-mating environments but not for applications requiring polarization or accidental-touch protection. UL94 V-0 rated housing material satisfies the flammability requirement for enclosed equipment.
Sourcing
Listed Active in the manufacturer lifecycle — quoted to order against the BOM quantity. The base product number 10119110 covers multiple position-count and orientation variants within the BERGSTIK II series; confirm the 38-position count and right-angle orientation match the BOM line before committing. No official cross-reference or successor is listed for this specific order code — if the design is being refreshed, cross-check the full series footprint before specifying an alternate.