
CONN HEADER VERT 14POS 3MM
$1.0400Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
- New & original stockTraceable channels only — no mixed lots, no re-taped reels.
- Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
- Photo-verified countsEvery line counted and photographed before the box closes.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | Minitek® Pwr 3.0 |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header |
| Fastening type | Locking Ramp |
| Voltage rating | 600VAC/DC |
| Current rating | Varies by Wire Gauge |
| Operating temperature | -40°C~105°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.433\" (11.00mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Tray |
| Features | Board Guide |
| Shrouding | Shrouded - 4 Wall |
| Termination | Kinked Pin, Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.118\" (3.00mm) |
| Positions | 14 |
| Row spacing - mating | 0.118\" (3.00mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.126\" (3.20mm) |
| Contact finish - mating | Tin |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 100.0µin (2.54µm) |
Sourcing this connector
Amphenol ICC (FCI) 10127721-141LF is available through IC Source Direct’s Shenzhen interconnect channel. Submit an RFQ with your required quantity and timeline; we return a firm quote covering MOQ, lead time, condition, and unit price — typically within one business day.
Need a match by specification instead of MPN? Provide pitch, pin count, current rating, mounting style, and operating temperature. We cross-reference against Amphenol ICC (FCI) and other authorised lines, returning datasheet-verified alternatives. Attach a full BOM for multi-brand consolidation into one shipment.