The 57102-G06-11ULF: The contact system splits plating by function: gold (GXT™) on the mating interface at 30.0 µin (0.76 µm) gives the durability and low contact resistance needed at the plug interface, while the solder-post side gets 78.7 µin (2.00 µm) of tin for solderability and oxidative protection on the PCB tail. Rated 2 A per circuit AC/DC at up to 200 V AC/DC — the 2.00 mm pitch and 2 A rating sit squarely in the signal/small-power range typical of board-to-board interconnects in industrial control, instrumentation, and consumer electronics, not power delivery. The housing is black thermoplastic rated UL94 V-0, with a 0.059" (1.50 mm) insulation height above the board surface and a 0.157" (4.00 mm) contact engagement length at mating, giving the push-pull header a reasonably positive seated feel in the matching receptacle.
Pin-one keying on an unshrouded header is defined by the board layout, not the connector — the square pin cross-section and 0.079" (2.00 mm) row spacing match standard Minitek® 2.00mm receptacle pitch so alignment posts in the receptacle bore the lateral tolerance; confirm your receptacle has the keying notch or polarizing slot you need before committing. The overall contact length of 0.315" (8.00 mm) and post length of 0.098" (2.50 mm) define the through-hole leg geometry — verify your PCB pad and via finish match the 2.00 mm pitch footprint before layout, particularly if this is a blind-mate or mezzanine stacking configuration.
The 57102-G06-11ULF carries an Active lifecycle status — quoted to order against BOM quantities; no official successor order code is listed on this record, so confirm with your Molex channel partner if your program is approaching a redesign window.