What This Connector Is
The Amphenol FCI 57202-G52-13ALF is the 26-circuit member of the Minitek® 2.00mm board-to-board header series. It is a dual-row, unshrouded male pin header with push-pull mating, surface-mount termination, and square contact geometry — a standard density interconnect suited for parallel board-stacking or coplanar configurations where the z-height budget calls for a sub-3 mm pitch. All 26 positions are populated across two rows at 0.079" (2.00 mm) pitch, with a matching 0.079" row spacing. The mating face carries gold GXT™ plating at 30.0 µin (0.76 µm); the solder tails are tin-plated at 78.7 µin (2.00 µm) — a graded finish that puts durability where the mate cycles occur while keeping solder-joint integrity intact. The connector is rated 2 A per contact at up to 200 V AC/DC, and the insulation body is black thermoplastic rated UL94 V-0. The contact length at the mating interface is 0.157" (4.00 mm), providing adequate engagement depth for reliable perpendicular board-to-board joining. Supplied in tape-and-reel packaging for automated SMT placement.
Plating Grade and What It Means for the Application
The gold GXT™ finish on the mating side at 30.0 µin (0.76 µm) puts this above a flash-gold tier — it will handle repeated mate/de-mate cycles without the surface degradation that thin gold flash risks. The tin-plated solder tails at 78.7 µin (2.00 µm) give a robust, wettable solder interface. For a board-to-board header that typically sees one permanent mate during assembly, the plating split is well-matched to the use case: the gold face survives the one engagement cleanly, while the tin tails take the thermal excursion of reflow without concern about joint integrity.