What the key ratings mean for fit
The 66925-017: At 34 positions across two rows at 0.100-inch pitch, this is a mid-density board-to-board signal and low-power interconnect — match the circuit count to the BOM before committing, since the 34-way count is fixed and all positions are loaded. The 0.240-inch (6.10 mm) insulation height sets the board-protrusion dimension; verify the enclosure or adjacent component clearances allow this stand-off. The right-angle orientation places the header flush to the PCB surface with the mating face perpendicular to the board plane — plan the cable or secondary board routing accordingly. The 0.115-inch (2.92 mm) tail length is standard for this pitch class and suits conventional through-hole pad layouts. Gold at 30.0 µin (0.76 µm) on the mating side signals durability against repeated mating cycles and lower contact resistance at first engagement — tin is the better choice for one-time field termination, but gold is the right call for any reconnect duty or vibration environment. Tin at 100.0 µin (2.54 µm) on the tails is thick enough for repeatable solder process window without wicking issues.