What this connector is
The Amphenol ICC (FCI) 66953-019LF is a 38-position dual-row board-to-board receptacle from the Dubox™ BergCon® PV™ series, operating at 0.100 inch (2.54 mm) pitch with through-hole solder termination. The connector carries a female socket contact type and uses a push-pull fastening mechanism — the mating half snaps in and is retained by the housing geometry rather than a separate locking tab. Rated 1250 V with gold contacts on the mating face and thick tin on the solder post, the connector spans -65°C to 125°C in service. The housing is black glass-filled polyester rated UL94 V-0.
Dual plating — what it means for the application
The mating face carries 30.0 µin (0.76 µm) gold; the solder tail carries 100.0 µin (2.54 µm) tin. The gold layer handles repeated mating cycles and maintains low contact resistance at the interface — the tin on the post is sized for solderability and solder-side durability, not for re-mating. In a board-to-board permanent stack the gold mating finish is the relevant figure for contact reliability over the product life; the tin post is not a wearing surface. The contact material is brass throughout.
Board footprint and stacking
The 0.100 inch row spacing and 0.325 inch (8.25 mm) insulation height define the standoff above the board. The 38-position dual-row layout at 2.54 mm pitch and the 0.138 inch (3.50 mm) post length drive the hole size and solder fill requirements for through-hole insertion.
Applications and environments
Listed for Automotive, General Purpose, Industrial, Medical, and Telecommunications applications. The -65°C to 125°C operating range and UL94 V-0 rating cover the thermal and fire-safety envelope for all five listed segments; the 1250 V rating is notably high for a 2.54 mm pitch connector and widens its use in higher-voltage industrial and infrastructure builds. The push-pull mating style is suited for applications where the board pair is mated and un-mated in service, though the gold thickness on the mating face — not a high-cycle specification — should be matched to the expected reconnect frequency.