The FCI 66953-020 is the 40-circuit member of the Dubox™/BergCon® PV board-to-board receptacle series, built around a dual-row 0.100 inch (2.54 mm) pitch array with square female contacts. Gold plating on the mating face (30.0 µin / 0.76 µm) protects the contact interface against wear and fretting through repeated mating cycles, while the solder post side receives a heavier 100.0 µin (2.54 µm) tin plate for solderability and long-term barrel integrity. The push-pull fastening type gives it a self-mating, tool-free engagement — it snaps together and stays locked without jack-screws or latches, which makes it a natural fit for blind-mate board stacking in industrial enclosures, telecom backplane modules, and medical instrumentation chassis where access to the mating face is limited. Rated 1250 V between adjacent circuits — well above the norm for a 2.54 mm pitch connector, and the margin that drives selection in industrial automation power rails and telecom infrastructure equipment where voltage headroom is a design requirement, not just a compliance floor.
The housing is black glass-filled polyester, rated UL94 V-0 for flame retardancy, with a 0.325 inch (8.25 mm) insulation body height and a post tail length of 0.138 inch (3.50 mm) for through-hole penetration into the PCB. Operating temperature spans -65 °C to 125 °C, covering the thermal extremes encountered in unheated industrial shelters and equipment mounted near heated bus compartments. All 40 positions are populated (crimp-termination-ready square socket contacts in brass). The insulation material is Polyester, Glass Filled — a substrate that handles the thermal cycling associated with solder reflow profiles and long-term field service in industrial environments.
Mates with the corresponding Dubox™/BergCon® PV header (the matching 40-position 2.54 mm dual-row male pin header) in a push-pull, self-fixturing engagement. The 0.100 inch row spacing and 0.100 inch pitch combine to give a standard 0.100 × 0.100 inch grid footprint — one of the most widely routed pitches in through-hole board design, with no special alignment features beyond the push-pull latch geometry. Confirm the z-height budget against the 0.325 inch insulation height and the board-to-board stack gap the mating header introduces.