The 67996-148HLF is the 48-circuit member of AMP's BERGSTIK II dual-row header family, a classic 0.100-inch (2.54 mm) pitch board-to-board interconnect that has been a staple of through-hole design for decades. Square phosphor bronze pins are pressed into a black UL94 V-0 housing, with 30µin gold or Gold GXT plating on the mating interface — the thicker precious-metal layer giving meaningfully better fretting resistance and higher mating-cycle durability than tin. Rated 3 A per contact at the pin with an operating envelope of -65 to 125 °C, the 67996-148HLF sits toward the upper end of the BERGSTIK II position-count range, making it a candidate for dense signal or moderate-power bus applications where the 0.100-inch pitch still fits the board routing budget.
What drives the fit decision
The 48-position, dual-row layout at 0.100-inch pitch occupies the upper end of the BERGSTIK II position-count range. The 0.100-inch insulation height means the mated pair sits flush with minimal standoff above the board surface. The 0.230-inch mating pin length accommodates standard receptacles; the 0.095-inch tail suits both paste-in-hole and wave-solder processes.
The unshrouded push-pull header mates with any standard dual-row 0.100-inch BERGSTIK II or mechanically equivalent IDC ribbon receptacle or card-edge socket. Verify that the receptacle's slot depth accommodates the 0.230-inch mating pin — shorter sockets will bottom out before full insertion.