The Amphenol FCI BERGSTIK II 67996-256HLF is a 56-position, dual-row board-to-board header terminated in through-hole solder, operating across a -65 to 125 °C window with a UL94 V-0 black PA nylon housing and 3 A per contact current rating on gold-plated phosphor bronze pins. The 0.100" (2.54 mm) pitch, square pin geometry, and dual-row layout on 0.100" row spacing give it a standard 0.100" × 0.100" grid footprint — the same as the original BERGSTIK line it extends. With all 56 positions loaded and the push-pull fastening type listed, the header ships fully populated and relies on the mating receptacle's retention feature rather than an integral lock; the contact length of 0.230" (5.84 mm) on the mating end and the 0.095" (2.41 mm) post length through the board define the engagement and board-attachment geometry respectively.
Selection parameters for board-layout and BOM commitment
Pitch is 0.100" (2.54 mm) on both axes — 0.100" between pins in each row and 0.100" between rows — so the footprint lands on a standard 0.100" grid. Current rating is 3 A per contact; the phosphor bronze base material and 15.0 µin (0.38 µm) gold or Gold GXT plating on the mating side govern the thermal margin. Contact finish is listed as gold or Gold GXT at 15.0 µin (0.38 µm) — the Gold GXT variant is the proprietary GXT (Gold eXtended Term) plating designed for improved solderability after multiple reflow passes, which matters for through-hole assembly flow. Insulation height of 0.100" (2.54 mm) matches the pitch — this header sits flush with the board surface when fully seated, so the board_layout_engineer confirms no component sits taller than the housing shoulder at any circuit position.