What this connector is
The Amphenol 68020-248HLF is the 48-circuit member of the BERGSTIK II dual-row board-to-board header series, operating at 0.100-inch (2.54 mm) pitch. This unshrouded male pin header with square contact geometry is designed for through-hole right-angle board stacking in industrial automation and instrumentation applications where a permanent or semi-permanent board-to-board connection is the design intent. All 48 positions are loaded, meaning the full dual-row array is populated and ready to mate with the matching BERGSTIK II receptacle.
Key ratings and what they mean for your design
48 positions across 2 rows at 0.100-inch pitch defines the board footprint — confirm the layout and keep-out zone can accommodate the full dual-row span plus clearance for right-angle routing underneath. Rated 3 A per contact. At full all-position load, thermal rise in the housing material becomes the governing constraint — the UL94 V-0 rating confirms the insulator handles temperature rise without deforming, but verify your actual simultaneous current per circuit against the derating curve in the product drawing for your board-side thermal environment. Gold or Gold GXT contact plating at 15.0 µin (0.38 µm) over the mating interface — this thickness grade is the higher tier within the series, providing substantially better make-and-break cycle performance than tin-plated alternatives. The push-pull fastening type is a friction-latch style; it delivers reliable retention in stable environments but does not carry the vibration-locking assurance of a screw-lock or bayonet coupling — assess the mechanical environment accordingly. Operating range of -65 °C to 125 °C — broad enough to cover most industrial and automotive instrument applications, including areas near sustained heat sources. The phosphor bronze contact substrate maintains mechanical properties across this window without the brittleness concerns of some alternatives at temperature extremes.
Applications and environments
Board-to-board stacking in industrial automation control modules, test and measurement equipment, and instrumentation where 0.100-inch pitch is the established interconnect standard. The push-pull header is suited to connections that are made once at final assembly or infrequently — not for repeated field mating. The wide temperature range and UL94 V-0 rating make it viable for in-rack instrumentation and equipment panels, though the unshrouded design means it is not sealed against dust or liquid ingress — the application should not require IP-rated sealing at the header interface itself.
Sourcing and lifecycle
Listed Active with no successor order code listed. Confirm the position count (48) and pitch (0.100 inch) against the mating receptacle before committing — sourced to order against your RFQ quantity.