What This Connector Is
The Amphenol FCI BERGSTIK 75844-118-12LF is a 12-circuit dual-row male header in the BERGSTIK series — an unshrouded breakaway header designed for board-to-board or cable interconnect at 0.100-inch (2.54 mm) pitch. Through-hole solder tails anchor it to the PCB; the square pin contacts accept the matching BERGSTIK receptacle orIDC termination. Gold-GXT contact plating at 30.0 µin (0.76 µm) thickness gives this header wear resistance above tin-plated alternatives, and the phosphor bronze base metal handles 5 A per circuit at the rated temperature ceiling.
Ratings That Drive the Fit Decision
Pitch is the gatekeeper: 0.100-inch (2.54 mm) is the standard grid that defines routing density and header footprint across the BERGSTIK line — it drops into the same land pattern as any 0.100-inch dual-row header in the series. The 5 A per circuit current rating puts this squarely in the signal-and-low-power zone; the gold-GXT plating grade (not tin) is what gives it the reconnection durability — critical if the board ships as a mated pair that gets unplugged in the field. Voltage is 110 V, which covers signal and most low-voltage power applications but is not a high-voltage candidate. Operating temperature span of -65°C to 130°C handles industrial cold-start and elevated ambient without derating concerns.
Board Layout Reality
Dual-row at 0.100-inch pitch means two parallel rows spaced 0.100 inch apart — the standard 0.100 × 0.100 grid gives a row pitch of 2.54 mm and a within-row pitch of 2.54 mm, so the header occupies a 6-position-wide footprint. Contact post length is 0.120 inch (3.05 mm) from the shoulder, which governs solder joint height in through-hole; overall contact length is 0.445 inch (11.30 mm). The unshrouded design means no keying slot — alignment relies on the mating receptacle's guide walls, so confirm the housing has sufficient lead-in chamfer if this goes into a production assembly.