What this connector is
The Amphenol FCI (now Amphenol ICC) 79425-122HLF is the 22-circuit member of the BERGSTIK II dual-row header series, a 0.100" (2.54mm) pitch board-to-board interconnect with male pin contacts intended for through-hole soldering into a PCB. The dual-row, unshrouded layout puts 22 square pins on 0.100" row spacing, giving a footprint density that sits squarely in the classic 2.54 mm pitch header class used across industrial controls, instrumentation, and white-goods boards. All 22 positions are loaded, so there is no partial-load option on this part number. Contact material is phosphor bronze with the mating interface finished in 30.0 µin (0.76 µm) gold or Gold GXT, which puts this member in the higher-plating tier of the BERGSTIK II series — that thickness is what gives the contact its durability against repeated mating cycles. Rated 5 A per contact at the rated temperature, and the insulation body carries a UL94 V-0 flammability rating, so it clears the flame-retardance gate for enclosed equipment compartments.
Ratings that drive the fit decision
Pitch and row spacing are both 0.100" (2.54mm), so the board footprint and the routing channel width are set by the 22-position dual-row layout. The 110 V rating is modest — this is a signal and low-power interconnect, not a power bus header. The 5 A per-contact rating is the headline figure, but the practical limit for any given circuit is shaped by how many contacts are simultaneously carrying current and what the ambient board temperature is — the spec table does not publish a derating curve, so if the board runs hot, treat 5 A as the ceiling rather than the target. The 30.0 µin (0.76 µm) gold plating on the mating interface is the spec to watch when you are choosing between members of this series — lower-plating variants exist with tin or thin gold finishes and those carry fewer guaranteed mating cycles. On this part number the gold thickness supports the push-pull retention model across a reasonable reconnect duty cycle, but if your application demands more than a few dozen cycles, verify the lifecycle figure against the specific mating half's housing spec.
Where this connector lives
The BERGSTIK II series is Amphenol ICC's go-to dual-row header for board-to-board stacking and board-to-cable adaptation across industrial automation, instrumentation, and consumer appliance PCBAs. The 0.100" pitch, black UL94 V-0 housing, and through-hole solder termination describe a connector that is designed for wave-soldered PCB assembly in a production panel — not for field wiring. The matching half would be a BERGSTIK II or compatible IDC receptacle housing with 0.100" pitch and dual-row pinout; confirm the keying and latch type of the mating housing before committing. Because the header is unshrouded and the fastening is push-pull only, this connector is best suited for applications where the board stack is fixed after assembly — not for repeated field disconnection. It works well as a board-to-board vertical stacking header in enclosed equipment where the mating pair is made once at final assembly and left alone.