What This Header Is
The Amphenol FCI 79425-158HLF is a 58-position dual-row BERGSTIK II board-to-board header in the 0.100 inch (2.54 mm) pitch family. It carries a male pin array with square contact shape, through-hole solder termination, and unshrouded push-pull mating — the style sits at the signal-density end of the BERGSTIK II range, where 58 circuits in a dual-row format delivers a dense but mechanically accessible footprint for card-edge or mid-plane board stacking.
Ratings That Drive Fit Decisions
Pitch is 0.100 inch (2.54 mm) — a standard grid that fits established board layout practice. The 58-position dual-row format uses this grid in the BERGSTIK II family. Current rating is 5 A per contact with the 30.0 µin (0.76 µm) gold contact finish suitable for applications with moderate reconnect duty. Voltage rating is 110 V — signal or low-power distribution within that ceiling, not a power bus connector at full 5 A. The housing is UL94 V-0 rated and the contact material is phosphor bronze; the insulation height is 0.100 inch (2.54 mm) from the board surface, which sets the mated stack height reference for board-to-board stacking.
Where It Goes
Board-to-board signal interconnect in industrial control, instrumentation, and communication equipment — the dual-row unshrouded header mates with the matching BERGSTIK II IDC receptacle or scannable card-edge connector in the same series. Push-pull fastening means it mates and unmates by hand without tooling, which is the standard for field-serviceable inter-board links in industrial automation.
Lifecycle and Sourcing
Listed Active. Quoted to order against BOM quantity — confirm the full 58-position footprint and the mating-half series before committing. The base product number 79425 anchors cross-references within the BERGSTIK II family.