What this connector is
The Amphenol FCI 79821-130HLF is the 30-circuit member of the BERGSTIK II unshrouded male header series — a dual-row 0.100-inch (2.54 mm) pitch board-to-board header intended for through-hole solder assembly on a parent board that receives a mating receptacle or daughtercard. The insulation height of 0.100 inches matches the pitch, which means the header seats flush with the board surface and the mated pair presents a flat stacking profile with no exposed shell above the plane of the board. Square pin contacts on 0.100-inch row spacing carry 5 A per circuit at up to 110 V — the phosphor bronze base metal with either gold or Gold GXT plating at 30.0 µin (0.76 µm) gives this header the durability to handle repeated mating cycles in instrument-rack and industrial automation environments where the connector is assembled once but may be field-swapped several times over the product life.
What the ratings mean for the fit
Push-pull fastening is self-retention on mating — there is no locking screw or latch, so this header suits applications where the daughtercard is held by its own board supports or a separate mechanical capture, not by the connector itself. The UL94 V-0 rated black housing confirms the plastics will not propagate flame under fault conditions, which matters for industrial or instrumentation enclosures.
Sourcing
Listed Active — quoted to order against BOM quantity via RFQ. The BERGSTIK II series is an established board-to-board header line; confirm the exact plating variant (gold vs Gold GXT) against your current datasheet revision, since the finish grade affects the effective contact resistance on first mate and the gas-tight joint stability under thermal cycling.