What this connector is
The Amphenol ICC 79821-462HLF is the 62-position member of the BERGSTIK II dual-row header family — a classic 0.100" (2.54 mm) pitch board-to-board interconnect that has been a staple in industrial automation and control equipment since the 1980s. Header type, male pin, unshrouded — the push-pull friction lock holds mated pairs together without a locking latch, making it suited for stable board-stack applications where the assembly is set and left in place rather than frequently disconnected. All 62 circuits are loaded, so every position is populated at the factory with no partial-load ambiguity in the BOM line. The housing is black polyphenylene sulfide (inferred from UL94 V-0 membership — no separate material entry) rated UL94 V-0, which covers the typical flame-retardance requirement for industrial control panel environments. Contact material is phosphor bronze, finished in bright tin on both the mating interface and the solder post, at a plating thickness of 100.0 µin (2.54 µm) on the mating surface — a heavier tin deposit than many signal-grade headers, which helps with solderability and shelf life but caps reconnection cycle durability compared to gold-plated alternatives.
What the key ratings mean
5 A per circuit at 110 V marks this as a capable header for the 0.100" pitch class, sufficient for distributing low-level power rails across multiple connector positions in a board-stack. The dual-row, 62-circuit configuration carries a significant aggregate current budget, but the per-contact 5 A limit governs — the circuit count distributes the power rails, it does not multiply the current per circuit. The 0.100" (2.54 mm) pitch sets the board footprint and routing density. Row spacing matches the pitch at 0.100" (2.54 mm), forming a uniform grid — simple to route around on a standard 2.54 mm pitch PCB. Contact finish is bright tin on both mating face and solder post at 100.0 µin (2.54 µm) mating thickness — the heavier deposit is more durable at the mating interface. For applications requiring more than a few dozen mate/unmate cycles, a gold-plated variant of this series would be the appropriate upgrade path. Termination is through-hole solder with a post length of 0.200" (5.08 mm) and overall contact length of 0.730" (18.54 mm) — the longer body provides good solder fillet formation and mechanical withdrawal strength in the plated through-hole. The insulation height of 0.100" (2.54 mm) sets the board-stack standoff for the mated pair; confirm your z-height budget matches before committing.
Sourcing and what to confirm before you commit
No official successor or cross-reference order code is listed for this part number. Verify with Amphenol ICC whether the BERGSTIK II series has been consolidated or migrated to a newer product line before designing it into a new platform, particularly if the design lifecycle extends beyond five years.