The Amphenol FCI 86503-426HLF is a 26-position, dual-row male pin header from the BERGSTIK II series, designed for board-to-board interconnects at 0.100" (2.54 mm) pitch. All 26 circuits are populated with square-pin contacts — tin-plated on both the mating face and the through-hole solder tail at 100.0 µin (2.54 µm) — rated 5 A per circuit up to 110 V. The push-pull fastening type provides a positive mating response; the unshrouded profile suits applications where polarization is handled by the housing or PCB layout rather than the header itself. With a UL94 V-0 black insulation body and 0.100" insulation height, it occupies a standard 2.54 mm grid footprint on the board.
Ratings that drive the fit decision
At 5 A per circuit and 110 V, this header sits comfortably in the signal-and-low-power range typical of 2.54 mm pitch headers — enough for indicator loads, control lines, and moderate-power distribution on a board stack. The dual-row, 26-circuit count is the primary BOM-match parameter: confirm the board footprint has 26 pads on the correct 0.100" grid with matching row spacing before committing. The tin plating on both mating and solder sides at 100.0 µin (2.54 µm) is a single-grade finish — no precious-metal option is listed in this entry, so mating-cycle life is governed by tin-tin wear rather than gold durability. The 0.470" overall contact length and 0.120" tail length tell you the board thickness window the through-hole is sized for — check your PCB stack-up against those dimensions. The insulation height of 0.100" (2.54 mm) equals the mating pitch — a flat-bottom header with no standoff. In a board-to-board stack where z-height is tight, this means the mated pair sits flush with the board surface; a board-level insulator or gasket beneath the body may be needed if the assembly requires a sealed interface at the board face.
Where this connector lives
BERGSTIK II headers are a staple of industrial control, instrumentation, and legacy equipment interconnects — the 2.54 mm pitch and unshrouded profile have been board-level standards for decades, which means this series turns up in mature products where a known footprint matters more than a newer pitch. The 26-circuit count is common in parallel-bus or multi-signal applications — industrial PLC I/O expansion, test-and-measurement channel routing, and cable-to-board distribution in equipment that predates mezzanine or high-density connectors. The push-pull mating style is faster than threaded or screw-lock types and holds adequately in low-vibration environments; in high-vibration settings a locking receptacle housing or board-mountinganodized header with a secondary latch is the standard mitigation since the header itself is unshrouded.
Active production — no lifecycle friction
The 86503-426HLF carries an Active lifecycle status — quoted to order against the BOM quantity. No official successor or cross-reference is listed on record for this specific entry. The 26-position count and standard 2.54 mm BERGSTIK II footprint are widely matched across the series, so a parametric cross-check within the same family is the fastest path if the exact part number is unavailable, but any substitute must be verified against the 0.100" row spacing, insulation height, and tail length to confirm mechanical fit in the specific PCB layout.