The Amphenol 86503-432HLF is the 32-position member of the BERGSTIK II dual-row header series, configured for board-to-board interconnects at the industry-standard 0.100" (2.54mm) pitch. The header carries tin-plated phosphor bronze contacts rated 5 A per circuit at 110 V, with 100 µin (2.54 µm) of plating on the mating face — a heavy tin finish suited to multiple mating cycles in industrial and instrumentation applications where reconnection is expected. The body is unshrouded and uses a push-pull fastening type, meaning the two-row pin array mates with a matching dual-row IDC or solder-cup receptacle by alignment and friction retention rather than a locking latch — plan for the mating half's retention mechanism when specifying the board-stack. The housing is black PA (polyamide) rated UL94 V-0, with an insulation height of 0.100" (2.54mm) — the same as the contact row pitch, which keeps the board footprint compact in dense two-row applications.
Sourcing and lifecycle
Listed Active under. Confirm the exact series suffix and plating grade against your BOM line before committing — BERGSTIK II ships in multiple tin- and gold-plating variants at the same position count, and the HLF suffix on this code is the identifier that locks in the heavy tin finish and Amphenol ICC/FCI as the manufacturer of record.