The Amphenol FCI BERGSTIK II 86503-458HLF is a 58-position dual-row 0.100-inch (2.54 mm) pitch board-to-board header rated 5 A per contact at 110 V, with tin-plated phosphor bronze contacts and a push-pull push-pull fastening mechanism that holds the mated pair without tool assist. The 2.54 µm (100 µin) tin plating on both the mating face and the solder post gives the contact system enough wear margin for repeated mating cycles — a meaningful step up from lighter tin grades that are specified primarily for single-mate assembly. The 58 positions across two rows at 0.100-inch row spacing represent the mid-to-high-density range within the BERGSTIK II family, with all positions loaded in the standard black UL94 V-0 housing. At 5 A per circuit and 110 V, this header covers the majority of board-to-board signal and moderate-power stacking roles in industrial and instrumentation equipment — the contact current is well within what phosphor bronze with this plating thickness handles without meaningful temperature rise at the contact interface.
Ratings that drive the fit decision
The 5 A per contact rating governs the current-carrying duty for each circuit in the stack — the voltage ceiling of 110 V is typical for instrumentation-class board interconnects and well within the creepage and clearance the 0.100-inch pitch provides. The square pin contact shape at 0.250-inch (6.35 mm) mating length provides a stable engagement depth with the matching receptacle; the post extends 0.120-inch (3.05 mm) beyond the board for through-hole solder termination, giving good heel fillet formation on the solder side. The 0.100-inch (2.54 mm) insulation height sets the mated stack profile — confirm this against the board-to-board z-height budget in the target assembly before committing. All 58 positions are loaded, which means no open positions to account for in the routing plan; the full dual-row footprint at 0.100-inch row spacing fits the standard BERGSTIK II pattern, so check board clearance and adjacent component keep-out accordingly.