What this connector is
The Amphenol ICC BERGSTIK II 86503-460HLF is a 60-position dual-row board-to-board header in the standard 0.100" (2.54 mm) pitch family. The square male pin is phosphor bronze with 100.0 µin (2.54 µm) tin plating on both the mating interface and the solder-post side, and the push-pull fastening keeps the mated pair seated without a locking latch. All 60 positions are loaded — no skipped contacts, no reduced-count variant to mis-order. The black nylon body carries a UL94 V-0 flammability rating, which is the governing material spec for board-level placement in enclosed equipment.
What the ratings mean for your board fit
The 0.100" pitch and dual-row layout give a 60-circuit footprint at 2.54 mm pitch. The 5 A per contact rating at 110 V is the per-circuit ceiling; because all positions are loaded and the insulation height is 0.100" (2.54 mm), the thermal path from contact to board is consistent across the full strip.
Where it goes and what it mates with
Board-to-board headers at this pitch and position count are the backbone of mid-density internal interconnects — the 60-position strip is common in backplane-daughtercard arrangements and in equipment where a single multi-circuit harness pass-through replaces several smaller connectors. The unshrouded header means the mating half must provide the side-wall guidance — a matching shrouded BERGSTIK II receptacle housing or an IDC edge-card connector of the same row spacing. The 0.100" row spacing must match the receptacle pitch exactly; the push-pull fastening type means the mating half has a corresponding locking feature to prevent unintentional disengagement. The through-hole solder tail accepts a 0.100" grid footprint on the PCB — no press-fit, no surface-mount gluing, just a standard wave or hand-solder process.