The Amphenol ICC 86503-466HLF is the 66-position member of the BERGSTIK II series — a dual-row 2.54 mm pitch board-to-board header built for through-hole soldering. Phosphor bronze contacts carry 5 A per circuit at up to 110 V, with 100 µin (2.54 µm) of tin plating on the mating face for durability in production assemblies. The push-pull fastening type relies on contact friction rather than a locking latch, so verify that your board spacing holds the pair seated in any vibration-prone application.
Amphenol ICC BERGSTIK II dual-row unshrouded header, 66 positions, 2.54 mm pitch, 5 A per circuit at 110 V, tin-plated phosphor bronze contacts, push-pull through-hole, UL94 V-0 black housing.
$1.8892Ref. price · indicative, final on quote
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Specifications
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Voltage | 110 V |
| Current | 5 A |
| Mounting | Through Hole |
| Connector size | Header |
| Contact material | Phosphor Bronze |
| Pitch | 0.100" (2.54 mm) |
| Package | Bag |
| Positions | 66 |
| Shrouding | Unshrouded |
| Orientation | Board to Board |
| Termination | Solder |
| Gender (Contact) | Male Pin |
| Contact plating | Tin |
| Locking (Fastening) | Push-Pull |
| Rows | 2 |
Product details
Frequently asked questions
What is the BERGSTIK II series, and what is this connector's style?
The 86503-466HLF is a board-to-board header in the BERGSTIK II series — a dual-row 2.54 mm pitch family from Amphenol ICC (FCI) designed for through-hole PCB stacking and daughter-card interconnects.
What compliance documentation does this part carry?
The housing is rated UL94 V-0; the HLF suffix on the order code indicates lead-free plating consistent with RoHS requirements. Consult the official datasheet for the complete REACH and full UL/CSA test letter.