Product overview
The Amphenol FCI (Amphenol ICC) 86832-102HLF is the 2-position member of the BERGSTIK II dual-row header series — a 0.100 inch (2.54 mm) pitch board-to-board interconnect with through-hole solder termination. The male pin header carries square contacts in phosphor bronze with 30.0 µin gold plating on the mating face, rated 5 A per circuit at up to 110 V. The housing is black UL94 V-0 rated; the push-pull fastening type relies on the header's own friction and header-to-receptacle fit rather than a locking latch — which is consistent with the series' use in internal board-to-board stacking where the mated pair is not subject to repeated field disconnection.
What the 2-position count means for selection
At 2 positions, this is the smallest circuit-count member of the BERGSTIK II family — designed for minimal board-to-board interconnects where only two signal or power circuits need to cross a board-to-board boundary. The 0.100 inch row spacing and dual-row layout mean the header occupies a 2-column footprint; the 0.100 inch post length sets the board penetration depth for the through-hole tails. If your BOM calls for more circuits, the series scales to higher position counts under the same base number 86832 — the 2-position simply represents the lower end of that range.
Gold plating and what it signals
The 30.0 µin gold finish on the mating contact puts this header in the durable-mating tier within the BERGSTIK II series — thick enough to support multiple plug cycles without the surface degradation that tin-plated contacts exhibit after repeated mates. For a 2-position board-to-board header, this is relevant when the board assembly will see field service or when the interconnect crosses a panel boundary where the header is plugged and unplugged during test or repair. The phosphor bronze base material provides good spring properties under the gold plate.