The Amphenol FCI 86832-104HLF is a 4-position, dual-row BERGSTIK II board-to-board header operating at 0.100 inch (2.54 mm) pitch. Push-pull fastening holds the mated pair without hardware — the latch engages and releases by hand, which speeds test-fixture swaps and field service where threaded hardware is a liability. All 4 circuits are loaded, and the contact finish is gold or Gold GXT at 30.0 µin (0.76 µm) over the mating zone.
What the ratings mean
At 5 A per contact and 110 V, this header covers signal and low-level power distribution in board-to-board stacking. The phosphor bronze base metal with 30 µin gold plating gives solid make-and-break endurance for the mating-cycle life of the series — the gold thickness governs reconnection duty more than the base metal. UL94 V-0 insulation material keeps the connector out of the flame-spread concern column in dense instrument enclosures.
Build and fit context
Through-hole solder posts at 0.100 inch pitch land on a standard 0.100-inch grid footprint — no tight routing density issue, and the square pin shape accepts hand-solder or wave-solder assembly. The unshrouded header leaves all four sides open, so the board layout must keep adjacent components clear of the pin field. Mating length of 0.325 inch (8.26 mm) and insulation height of 0.100 inch (2.54 mm) define the engaged stack profile; the overall contact length of 0.525 inch (13.34 mm) sets the board-side lead length.
Where it fits in the BERGSTIK II series
The 86832-104HLF carries base product number 86832 — the 4-position entry in a dual-row family that scales across a range of circuit counts. At 4 positions this is the smallest member, pitched at the same 0.100 inch grid as every other BERGSTIK II variant, so footprint and board routing are consistent across the series. The black insulator and push-pull fastening type are shared across the series; the gold or Gold GXT finish at 30 µin is the higher-spec plating tier within the family.