What the 86832-118HLF Is
The Amphenol FCI BERGSTIK II 86832-118HLF is an 18-position dual-row unshrouded header designed for board-to-board interconnects at 0.100" (2.54 mm) pitch. Square male pins mate with the matching IDC or friction-lock receptacle housing in the BERGSTIK II series. Gold-over-nickel plating at 30.0 µin (0.76 µm) on the mating face gives the contact durability to support repeated mating cycles, while the phosphor bronze body carries 5 A per circuit at up to 110 V — a combination that covers most low-power signal and control-plane interconnects in industrial and instrumentation applications. Through-hole solder tails anchor the header to the PCB with mechanical retention suited to production wave or hand-solder workflows.
Board Layout Notes
At 0.100" row spacing and 0.100" pitch within each row, the dual-beam footprint lands on a standard 2.54 mm grid — compatible with most DIP and pin-grid-array routing strategies. The 0.100" (2.54 mm) insulation height sits flush with the board surface, so the mated pair adds only the receptacle's plastic thickness to the stack. The push-pull fastening type means there is no jack-screw or latch to budget for in the enclosure; the header relies on pin insertion force for retention, which is acceptable for fixed-installation board-to-board mezzanine or stacking roles where the assembly is not field-serviced. All 18 positions are loaded — no partial-load skip rows to manage.