What This Connector Is
The Amphenol FCI 86832-460HLF is the 60-circuit member of the BERGSTIK II dual-row header series — a 0.100 inch pitch unshrouded male board-to-board header with square pin contacts and through-hole solder termination. All 60 positions are loaded. The contacts are phosphor bronze with 100 µin of tin plating on both the mating face and the solder-tail post, rated 5 A per circuit at 110 V.
Board-to-Board Fit and Footprint
Two rows at 2.54 mm pitch with 2.54 mm row spacing carry the standard BERGSTIK II dual-row footprint — the 60-position variant fits the same board routing grid, scaled in length. The 0.100 inch post length sits within the typical panel thickness for through-hole reflow-and-wave assembly.
Typical Applications
Unshrouded push-pull headers at 0.100 inch pitch are the default board-to-board vertical interconnect in industrial automation, instrumentation, and communications equipment where a shrouded keying feature is not required and a matching 0.100 inch IDC or friction-fit receptacle provides the mating half.
What the Key Ratings Mean
The 5 A per contact rating is a per-circuit limit at the mating interface — a 60-way header can carry 60 independent 5 A signal paths simultaneously, limited by the board's thermal and trace current budget rather than the contact itself. Tin plating at 100 µin (2.54 µm) on both mating and post surfaces is optimised for reconnection cycles and solderability rather than high-frequency signal integrity, so this is a power/signal board-to-board header, not an RF or precision-analog mate. The UL94 V-0 housing flammability rating meets the ignition-resistance requirement for most industrial and telecom equipment enclosures.
Sourcing and Lifecycle
The 86832-460HLF carries an Active product status — this is a standard BOM-line part, sourced to order against an RFQ. No official successor or cross-reference order code appears on record; confirm the BERGSTIK II 60-position footprint and mating half match the board layout before committing.