What this connector is
The Amphenol ICC 86837-150HLF is the 50-circuit member of the BERGSTIK II series — a dual-row, 0.100 inch (2.54 mm) pitch unshrouded pin header designed for board-to-board stacking applications. All 50 positions are loaded with square male pins, and the push-pull fastening type relies on the mating receptacle's retention to secure the pair. The contact material is phosphor bronze with a gold or Gold GXT™ plating at 30.0 µin (0.76 µm) on the mating interface, rated 5 A per contact at the header's current rating.
Ratings that drive the fit decision
Pitch and row spacing are both 0.100 inch (2.54 mm), so the footprint is a standard 0.100-inch dual-row grid. The 5 A per contact current rating applies to the individual circuit; the 110 V voltage rating sets the dielectric ceiling for the system. Plating thickness of 30.0 µin (0.76 µm) on the mating surface is a mid-range gold finish that supports repeated mating cycles — the UL94 V-0 housing material defines the thermal ceiling for current derating. Insulation height is 0.100 inch (2.54 mm), matching the pitch — the header sits flush with the board surface at that stack-up. The post extends 0.120 inch (3.05 mm) beyond the board for through-hole solder tail engagement, and the overall contact length is 0.600 inch (15.24 mm), meaning the full mated engagement depth is 0.380 inch (9.65 mm) on the mating side.