What this connector is
The Amphenol FCI (now Amphenol ICC) 87052-150HLF is the 50-position member of the BERGSTIK II dual-row board-to-board header series, operating at 0.100" (2.54 mm) pitch. It is an unshrouded male pin header with push-pull fastening — the board-retainable push-pull interface holds the mated pair without jack-screws or tooling, which is common in low-profile internal board stacking and signal interconnect where tool-free mating is preferred. Through-hole solder termination anchors the header to the PCB with mechanical integrity suited to production assembly. Rated 5 A per contact and 110 V, with 30.0 µin (0.76 µm) gold-plated phosphor bronze contacts — the plating grade and thickness support repeated mating cycles in instrumentation and industrial automation applications.
Key ratings and what they mean
The 50 positions in a dual-row configuration at 0.100" pitch is the primary fit parameter — it determines the board footprint and the routing density the connector occupies on the PCB. Each of the 50 contacts is rated 5 A, which is the per-contact limit at the stated voltage (110 V); the phosphor bronze base material and the 30 µin gold plating on the mating surface govern contact resistance and cycle life rather than raw current capacity. The 0.770" (19.56 mm) contact mating length is notably long for a 0.100" pitch part — the extended pin reaches well into the receptacle, which helps in shrouded or sealed board-to-board stacking where the mated interface must be protected from side load. The push-pull fastening type means no hardware is needed to secure the pair; confirm the receptacle side carries a compatible push-pull locking feature before specifying. UL94 V-0 rated housing material means the connector body is self-extinguishing and suitable for enclosed equipment where flame propagation must be controlled.
What the BERGSTIK II series is used for
BERGSTIK II headers are board-to-board interconnects used in industrial control and instrumentation equipment with a tool-free mating interface. The dual-row 0.100" pitch format at 50 positions is a long-standing industry standard compatible with many IDC receptacles. The 0.100" row spacing and 0.100" insulation height define the mated stack height when paired with the correct receptacle. The unshrouded header relies on the housing or board layout for polarization.