What this connector is
The Amphenol ICC (FCI) 87052-164HLF is the 64-circuit member of the BERGSTIK II unshrouded header series — a dual-row 0.100 inch (2.54 mm) pitch board-to-board header built for through-hole solder assembly. It delivers 5 A per contact at 110 V with gold-plated phosphor bronze contacts at 30.0 µin (0.76 µm) thickness on the mating surface, and uses a push-pull fastening type rather than the friction-fit common at this pitch.
Board-to-board fit at 0.100 inch pitch
The 0.100 inch pitch and 0.100 inch row spacing define a standard 2.54 mm grid footprint — the same as many dual-row headers from multiple manufacturers, which means the land pattern transfers directly to most layouts built for this pitch class. The unshrouded design allows the header to sit flush with the board surface but relies entirely on the push-pull mating force for retention — no polarizing ribs, no keying slot. The 0.100 inch (2.54 mm) insulation height and 0.770 inch (19.56 mm) post engagement length describe the mated stack envelope: the pin extends well into the receptacle contact cavity, which matters when the mating half is a low-profile IDC socket or a reduced-plating header being used in a board-stacking role.
Mating half and series compatibility
The 87052-164HLF mates with any dual-row 0.100 inch pitch BERGSTIK II or functionally equivalent 64-position IDC receptacle, ribbon socket, or wire-wrap header with the same pin arrangement. The header is unshrouded, which means it cannot polarize the mating direction on its own — if the application needs keying, that must come from the mating connector or the board layout. The square pin contact shape is standard across the BERGSTIK II series, so the matching receptacle's bifurcated or closed-slot contact geometry will determine the insertion feel and normal force at the interface.