Board layout check points
The 87052-424HLF: The 0.100 inch pitch and dual-row layout land on a standard header DRC grid — routing channels between adjacent pins use conventional trace/space rules without compression. The insulation height of 0.100 inch (2.54 mm) matches the mating pin engagement length, keeping the mated interface within a conventional board-stack height envelope. Solder-tail post length is 0.120 inch (3.05 mm); confirm the board thickness accepts this profile.
Contact rating and what it means for the circuit
Rated 5 A per contact at 110 V — the tin-on-tin plating grade and phosphor bronze base metal handle standard industrial signal and moderate power paths. At 5 A per circuit the current density sits well within the contact material's safe operating window; the 100.0 µin (2.54 µm) tin on both surfaces provides durable wipe and good solderability for through-hole reflow or wave assembly. The push-pull fastening type refers to the header's retention in a matching IDC or insulation-displacement receptacle; the through-hole leads carry mechanical board attachment.