The Amphenol ICC 87185-130HLF is the 30-circuit member of the BERGSTIK II single-row header series, configured as an unshrouded male pin header rated 5 A per circuit at 110 V with through-hole push-pull termination. Contacts carry 30.0 µin (0.76 µm) gold or Gold GXT plating on the mating face over a phosphor bronze base, and the black PA nylon housing meets UL94 V-0 flammability. The 0.100-inch (2.54 mm) pitch aligns with the standard 2.54 mm grid used across the BERGSTIK II family for board-to-board stacking and panel-interconnect applications.
Board-to-board fit is driven by the 30-position single-row layout and 0.100-inch pitch — the header mounts on a 30 × 2.54 mm grid, and the 0.100-inch (2.54 mm) insulation height defines the mated stack profile when it pairs with a matching receptacle. The unshrouded design accepts any BERGSTIK II or industry-standard 2.54 mm pitch receptacle with the corresponding circuit count; confirm the receptacle polarity keying because the header itself carries no polarizing rib. Square pin cross-section and the push-pull fastening type mean the header relies on through-hole solder fill for mechanical retention — no discrete locking tab engages the receptacle, so the board layout must account for any vibration environment with additional board-level support or a latching mate.
The 1.043-inch (26.49 mm) contact mating length and 0.095-inch (2.41 mm) post length specify how deep the pin plunges into the receptacle and how much lead extends through the PCB — both matter for footprint definition in the CAD library. The gold plating grade at 30.0 µin supports repeated mating cycles better than tin-plated alternatives in the same series, making this suited for test-fixture and instrumentation applications where the header sees regular connect-disconnect cycles.