The Amphenol ICC 87900-118HLF is the 18-position member of the BERGSTIK II dual-row header series, designed for board-to-board interconnection at standard 0.100 inch (2.54 mm) pitch. Phosphor bronze contacts carry 5 A per circuit at up to 110 V, with 0.76 µm gold plating on the mating surface — the plating grade and 5 A rating together place this firmly in the signal-mixed connector class, where the current headroom covers more than bare logic-level loads but the voltage rating is not suited to power-distribution rails. The header is unshrouded with square male pins, through-hole solder termination, and push-pull fastening — the push-pull retention is adequate for fixed internal board-to-board stacks where the mated pair is not routinely disconnected. All 18 positions are loaded; the 0.720 inch post length gives substantial engagement depth into the mating receptacle. The black PA housing carries a UL94 V-0 flammability rating, which is the relevant compliance detail for industrial equipment enclosures where the board assembly sits. The 0.100 inch insulation height and dual-row 0.100 inch row spacing keep the footprint on the standard 2.54 mm grid — routing density is governed by the 18-position count and the board-to-board stack geometry rather than the pitch itself.
This header mates with the matching BERGSTIK II 18-position receptacle housing — confirm the housing order code before committing, since the series covers a wide position-count range from which only the correct housing polarity and polarity keying ensure a correct mate. The square-pin contact shape and push-pull fastening mean the receptacle must carry a corresponding push-pull latch to lock the pair positively.