What this connector is
The Amphenol FCI 87900-130HLF is the 30-position member of the BERGSTIK II dual-row header series, built for board-to-board interconnects at 0.100-inch (2.54 mm) pitch. It carries 5 A per contact in a gold-over-nickel plating (30.0 µin / 0.76 µm) on phosphor bronze male pins, terminated via through-hole solder to the PCB. All 30 positions are fully loaded — no partial-load ordering needed. The housing is UL94 V-0 black, and the insulation height matches the 0.100-inch row spacing, keeping the mated pair flat in a mezzanine or stacked board configuration.
Ratings that drive the fit decision
Pitch at 0.100 inch (2.54 mm) and 30 positions across two rows define the board footprint. The 5 A per contact rating handles signal and moderate power paths; the gold plating grade (30.0 µin / 0.76 µm) gives low contact resistance at first mate and supports the lifecycle the connector needs in industrial environments. Voltage rating is 110 V — the limiting factor for high-voltage industrial or power-conversion applications sits here, not in the current. The push-pull fastening type provides a positive mating force without tools, though the header is unshrouded, so the mated pair needs adequate clearance or a mating receptacle with its own polarizing keys.
Lifecycle and sourcing posture
Listed Active. No official successor or cross-reference for this series member — the BOM line is the part number, and the 30-position count, dual-row layout, and gold plating grade all confirm the match directly. The part is quoted to order against the BOM quantity; confirm the 87900 base number and the -130HLF suffix before committing, since BERGSTIK II spans multiple position counts in the same 87900 series.