The Amphenol FCI 87900-132HLF is the 32-position member of the BERGSTIK II dual-row header series, a long-established 0.100" (2.54mm) pitch board-to-board interconnect used across industrial automation, telecom infrastructure, and instrumentation equipment. The header terminates via through-hole solder and uses a push-pull friction-lock — no screw hardware, which keeps the footprint compact but limits the reconnection cycle envelope compared to a locking variant. All 32 positions are loaded. Contacts are phosphor bronze with either gold or Gold GXT plating at 30.0µin (0.76µm) thickness on the mating side, rated 5A per circuit at 110V. The insulation height of 0.100" (2.54mm) matches the row spacing — a self-aligning stack height typical of the BERGSTIK II footprint used in perpendicular or parallel board stacking in legacy industrial systems.
What the ratings mean for selection
Pitch and row count are the primary fit drivers: 0.100" (2.54mm) dual-row with 32 positions defines the board footprint and routing density. The mating half must carry the matching 32-way dual-row BERGSTIK II receptacle — unshrouded to unshrouded, square pin to square socket. The row spacing of 0.100" sets the centreline-to-centreline distance between the two rows. The header is rated 5A per contact at 110V — individual circuit duty. At 5A per circuit this header handles power-path or mixed-signal board-to-board links, not just low-level logic. The unshrouded push-pull design fits where keying and vibration retention are handled elsewhere in the system. If the board stack sees mechanical shock or repeated unmating, a shrouded or locking variant within BERGSTIK II is worth evaluating.
Sourcing and lifecycle
The part is listed Active per with no confirmed successor. The BERGSTIK II family is a long-standing series — if the design requires a replacement or second-source, the 87900 base series is the starting point for a parametric search rather than a confirmed swap.